Other advantages of these liquid alloy systems are their inherent electrical conductivity. This allows for the use of these materials in specific heat-conducting applications, such as heat dissipation in sensitive components during operation, machining, and/or manufacturing. Thermal ManagementĪlloy systems that are liquid at room temperature have a high degree of thermal conductivity, far superior than ordinary non-metallic liquids. In addition to soldering, Indium Corp provides low-temperature solutions for thermal management, hermetic sealing, fusible alloys, eye glass lens blocking, and more. In fact, under the right process conditions, Durafuse LT’s performance is comparable to SAC305. Durafuse LT is more robust and increases durability in drop shock, not just incrementally, but by a significant measure. Older legacy low-temp options are brittle and tend to crack when stressed, which make them unsuitable for many applications.This provides greater drop shock and thermal cycling performance as compared to the typical BiSnAg alloys currently on the market. This new alloy reflows at 200☌ and uses a novel solder alloy process to bring mid-temperature solder properties into the upper edge of the low-temperature space. Indium Corp has invented a new low-temperature solder paste called Durafuse LT.Large area array devices – such as BGAs – to avoid head-in-pillow (HIP) and non-wet-open (NWO) failures.Low melting or low-Tg flex circuitry which are used in cellphones, smartwatches, and many internet-of-things (IoT) devices.Eliminating warpage of thinner chips due to high-temperature reflow.Step soldering, when a secondary, lower temperature reflow process is required after a standard SAC soldering process is completed.Attachment of temperature-sensitive components to printed circuit boards.Others, such as our TacFlux010 ® were very resilient at these temperatures.įor more information about these test results, please contact myself or Brandon. Some fluxes did what we expected- they charred and burned. They simply were not designed for this environment. 80AuSn solder preforms 0.249” square x 0.002”.The reflow profiles used tested the extreme abilities of our fluxes: So I, along with my fellow engineer, Brandon Judd, sought out to test some of our best fluxes with Au alloys at these high temperatures. The result: Not all, but a few of these fluxes work extremely well up to temperatures as high as 450☌!!! Since these alloys contain ≥80% gold and are resistant to oxidation, flux is not always necessary. Other methods have conventionally replaced the flux function, such as mechanical scrubbing, or forming gas purging. If these technologies are not available, or assembly speed is priority though, a flux may be required. Solder fluxes have not traditionally been used with AuSn, AuGe, or AuSi eutectic solder, because their peak reflow temperatures were very close to or above the flux activation range. An average flux activates at approximately 125☌ and is not recommended for temperatures in excess of 350☌. Although AuSn solder melts at 280☌, peak reflow temperatures are recommended to be >300☌, nearing the maximum suggested temperature of flux. AuGe and AuSi alloys melt at 356☌ and 363☌ respectively, which exceed the documented flux activation range. Recent test results show that solder fluxes handle high reflow temperatures (>450☌), providing better-than-expected visual results of flux residue! SiP & Heterogeneous Integration & Assembly (HIA).The Indium Corporation & Macartney Family Foundation.
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